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HDI-PCB-High-Density-Interconnection-PCB-HDI circuit board

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Product Detail

Specification for this HID PCB:

• 8 layers,

• Shengyi FR-4,

• 1.6mm,  

• ENIG 2u",

• inner 0.5OZ, outer 1OZ oz

• black soldmask,  

• white silkscreen,

• plated on filled via,


• Blind & buried vias

• Edge gold plating,

• Hole density: 994,233

• Test point: 12,505

• laminate/pressing: 3 times

• mechanical + controlled depth drill

+ laser drill (3 times)

HDI technology mainly has higher requirements on the size of the printed circuit board aperture, the width of the wiring, and the number of layers. It requires more buried blind holes and shows high-density development. Among the various PCB products  required by high-end servers, the communication and computer industries  account  for a relatively large proportion, and the demand for HDI circuit boards is relatively  high. The current HDI board market share in the domestic market is very promising.  


Server HDI cards, mobile phones, multi-function POS machines, and HDI security cameras aluse HDI high-density boards on a large scale. The HDI circuit board market continues to develop towards high-end, high-level, and high-density, continuously affecting our communications business and promoting the continuous advancement of technology. HDI PCB (High Density Interconnect PCB) is a relatively high line distribution density of circuit boards using microblind and buried via technology. This is a process that includes inner and outer wires, and then uses holes and metallization in the holes to achieve the function of joining each inner layer. With the development of high-density and high-precision electronic products, the requirements for circuit boards are the same. The most effective way to increase PCB density is to reduce the number of through holes, and accurately set blind and buried holes to meet this requirement, thereby generating HDI boards.

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