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HDI-Printed-Circuit-Boards

With a positive and progressive attitude to customer's curiosity, our organization repeatedly improves our products top quality to meet the wants of consumers and further focuses on safety, reliability, environmental necessities, and innovation of HDI-Printed-Circuit-Boards, High-Density-Interconnection-PCB , Pcb 12v , cheap assembly service , We are always looking forward to forming successful business relationships with new clients around the world. Our well-equipped facilities and exceptional good quality manage throughout all stages of production enables us to guarantee total shopper satisfaction for HDI-Printed-Circuit-Boards, With all these supports, we can serve every customer with quality product and timely shipping with highly responsibility. Being a young growing company, we might not the best, but we're trying our best to be your good partner.


  • Testing

    Testing

    When a circuit board is soldered, checking whether the circuit board can work normally, usually do not directly supply power to the circuit board, but follow the steps below: 1. Whether the connection is correct. 2. Whether the power supply is short-circuited. 3. Installation status of components. 4. Perform open circuit and short circuit tests first to ensure that there will be no short circuit after power on. The power-on test can only be started after the above ha...
  • DIP-Assembly

    DIP-Assembly

    Dual in-line package is also called DIP package, DIP or DIL for short. It is an integrated circuit packaging method. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, called row needle. The components of the DIP package can be soldered in the through holes plated on the printed circuit board or inserted into the DIP socket. Integrated circuits often use DIP packaging, and other commonly used DIP packaging...
  • Special-Material-PCB

    Special-Material-PCB

    Details for this Rogers PCB Layers: 2 layers Material: Rogers 4350B Base board thickness: 0.8mm Copper thickness: 1 OZ Surface Treatment: Immersion Gold Soldmask Color: Green Silkscreen Color: White Application: RF communication equipment Rogers is a type of high-frequency board produced by Rogers. It is different from the conventional PCB board—epoxy resin. It has no glass fiber in the middle and uses cerami...
  • 12-layers-PCB

    12-layers-PCB

    Some more information for this 12 layers PCB Board Layers: 12 layers Finish board thickness: 1.6mm Surface Treatment: ENIG 1~2 u” Board Material: Shengyi S1000 Finish Copper thickness: 1 OZ inner layer, 1 OZ out layer Soldmask Color: Green Silkscreen Color: White With Impedance Control Blind & buried vias What are the basic principles of impedance and stack design considerations for multilayer boards? When...
  • 10-layers-PCB

    10-layers-PCB

    Detail specification for this 10 layers PCB: Layers 10 layers Impedance Control Yes Board Material FR4 Tg170 Blind & Buried Vias Yes Finish Board Thickness 1.6mm Edge Plating Yes Finish Copper Thickness inner 0.5 OZ, outer 1 OZ Laser Drilling Yes Surface Treatment ENIG 2~3u” Testing 100% E-testing Soldmask Color Blue Testing Standard IPC Class 2 Silkscreen Color White Lead Time 12 days after EQ   What is a multilayer PCB and what are the characteristics of a multilayer b...
  • 8-Layers-PCB

    8-Layers-PCB

    This is an 8 layers PCB board with the specification as below: 8 layers Shengyi FR4 1.0mm ENIG 2u” Inner 0.5OZ, out 1OZ Matt black soldmask White silkscreen Plated on filled via With blind via 10 pcs per panel   How is the multilayer board laminated? Laminating is the process of bonding each layer of circuit sheets into a whole. The whole process includes kiss pressing, full pressing and cold pressing. In the kiss pressure stage, the resin infiltrates the bonding surface and fills the gaps in...
  • HDI-PCB

    HDI-PCB

    Specification for this HID PCB: • 8 layers, • Shengyi FR-4, • 1.6mm,   • ENIG 2u", • inner 0.5OZ, outer 1OZ oz • black soldmask,   • white silkscreen, • plated on filled via, Specialty: • Blind & buried vias • Edge gold plating, • Hole density: 994,233 • Test point: 12,505 • laminate/pressing: 3 times • mechanical + controlled depth drill + laser drill (3 times) HDI technology mainly has higher requirements on the size of t...
  • Good quality Rigid-Double-Sided-Pcb - Double-Sided-PCB – Kaz

    Good quality Rigid-Double-Sided-Pcb - Double-Sided-PCB – Kaz

    Using the right thickness of material is important for building FR4 PCBS. Thickness is measured in inches, such as thousands, inches, or millimeters. There are a few things to consider when choosing a FR4 material for your PCB. The following tips will  simplify your selection process: 1. Select thin FR4 materials for building panels with space constraints. Thin materials can support the various sophisticated components needed to build the device, such as Bluetooth accessories, USB connec...
  • High reputation Hdi-Printed-Circuit-Boards - 4 layers PCB – Kaz

    High reputation Hdi-Printed-Circuit-Boards - 4 layers PCB – Kaz

    Specification for the 4 layers PCB:  Layers: 4  Board Material: FR4  Finish Board thickness: 1.6mm  Finish copper thickness: 1/1/1/1 OZ  Surface Treatment: Immersion Gold (ENIG) 1u”  Soldmask Color: Green  Silkscreen Color: White  With Impedance Control   The biggest difference between PCB multilayer boards and single-sided and double-sided boards is the addition of an internal power layer (to maintain the internal electrical layer) and a ground layer. The power supply and ground wire ne...
  • New Fashion Design for Aluminium-Substrate-Printed-Board - Single-Layer-FR4-PCB – Kaz

    New Fashion Design for Aluminium-Substrate-Printed-Board - Single-Layer-FR4-PCB – Kaz

    What are the advantages of FR4 materials in PCB manufacturing FR-4 material, this is the abbreviation of glass fiber cloth, it is a kind of raw material and substrate circuit board , the general single, double-sided and multi-layer circuit board are made of this! It is a very conventional  plate! Such as Shengyi, Jiantao (KB), Jin An Guoji are the three major domestic manufacturers, such as only do FR-4 materials of circuit board manufacturers: Wuzhou Electronics, Penghao Electronics, Wanno E...
  • Manufacturer for Bare-Printed-Circuit-Board - 10-layers-PCB – Kaz

    Manufacturer for Bare-Printed-Circuit-Board - 10-layers-PCB – Kaz

    Detail specification for this 10 layers PCB: Layers 10 layers Impedance Control Yes Board Material FR4 Tg170 Blind & Buried Vias Yes Finish Board Thickness 1.6mm Edge Plating Yes Finish Copper Thickness inner 0.5 OZ, outer 1 OZ Laser Drilling Yes Surface Treatment ENIG 2~3u” Testing 100% E-testing Soldmask Color Blue Testing Standard IPC Class 2 Silkscreen Color White Lead Time 12 days after EQ   What is a multilayer PCB and what are the characteristics of a multilayer b...
  • Fast delivery Multilayer-Pcb-Supplier - SMT-Assembly – Kaz

    Fast delivery Multilayer-Pcb-Supplier - SMT-Assembly – Kaz

    SMT Assembly production line is also called Surface Mount Technology Assembly. It is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology, and has become a new generation of assembly technology in electronic product manufacturing. The main equipment of SMT production line includes: printing machine, placement machine (electronic components on...
  • China Supplier Lighting-Pcb - Single-Layer-Aluminum-PCB – Kaz

    China Supplier Lighting-Pcb - Single-Layer-Aluminum-PCB – Kaz

    Aluminum based circuit board: Aluminum substrate circuit, also known as circuit board, is a unique metal clad copper plate with good thermal conductivity, electrical insulation performance and mechanical processing performance. It is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers: Circuit layer: Copper clad equivalent to ordinary PCB, circuit copper foil thickness is 1oz to 10oz. Insulation layer: The insulation layer is a la...
  • Top Quality Medical-Circuit-Board - DIP-Assembly – Kaz

    Top Quality Medical-Circuit-Board - DIP-Assembly – Kaz

    Dual in-line package is also called DIP package, DIP or DIL for short. It is an integrated circuit packaging method. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, called row needle. The components of the DIP package can be soldered in the through holes plated on the printed circuit board or inserted into the DIP socket. Integrated circuits often use DIP packaging, and other commonly used DIP packaging parts include DIP switche...
  • Final-Function-Testing Suppliers –  Conformal Coating – Kaz

    Final-Function-Testing Suppliers – Conformal Coating – Kaz

    Advantages of automatic three-proof paint coating machine: one-time investment, life-long benefit. 1. High efficiency: automatic coating and assembly line operation greatly increase productivity. 2. High quality: The coating amount and thickness of the three-proof paint on each product are consistent, the product consistency is high, and the three-proof quality is stable and reliable. 3.  High precision: selective coating, uniform and accurate, coating precision is much higher than manual. ...
  • Hot Selling for Metal-Core-Pcb - Double-Sided-PCB – Kaz

    Hot Selling for Metal-Core-Pcb - Double-Sided-PCB – Kaz

    Using the right thickness of material is important for building FR4 PCBS. Thickness is measured in inches, such as thousands, inches, or millimeters. There are a few things to consider when choosing a FR4 material for your PCB. The following tips will  simplify your selection process: 1. Select thin FR4 materials for building panels with space constraints. Thin materials can support the various sophisticated components needed to build the device, such as Bluetooth accessories, USB connec...
  • New Fashion Design for Aluminium-Substrate-Printed-Board - 8-Layers-PCB – Kaz

    New Fashion Design for Aluminium-Substrate-Printed-Board - 8-Layers-PCB – Kaz

    This is an 8 layers PCB board with the specification as below: 8 layers Shengyi FR4 1.0mm ENIG 2u” Inner 0.5OZ, out 1OZ Matt black soldmask White silkscreen Plated on filled via With blind via 10 pcs per panel   How is the multilayer board laminated? Laminating is the process of bonding each layer of circuit sheets into a whole. The whole process includes kiss pressing, full pressing and cold pressing. In the kiss pressure stage, the resin infiltrates the bonding surface and fills the gaps in...
  • Factory Price For Flexible-Circuit-Pcb - Single-Layer-Aluminum-PCB – Kaz

    Factory Price For Flexible-Circuit-Pcb - Single-Layer-Aluminum-PCB – Kaz

    Aluminum based circuit board: Aluminum substrate circuit, also known as circuit board, is a unique metal clad copper plate with good thermal conductivity, electrical insulation performance and mechanical processing performance. It is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers: Circuit layer: Copper clad equivalent to ordinary PCB, circuit copper foil thickness is 1oz to 10oz. Insulation layer: The insulation layer is a la...
  • Best Price for Isola-Pcb - DIP-Assembly – Kaz

    Best Price for Isola-Pcb - DIP-Assembly – Kaz

    Dual in-line package is also called DIP package, DIP or DIL for short. It is an integrated circuit packaging method. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, called row needle. The components of the DIP package can be soldered in the through holes plated on the printed circuit board or inserted into the DIP socket. Integrated circuits often use DIP packaging, and other commonly used DIP packaging parts include DIP switche...
  • 18 Years Factory Power-Supply-Circuit-Board - SMT-Assembly – Kaz

    18 Years Factory Power-Supply-Circuit-Board - SMT-Assembly – Kaz

    SMT Assembly production line is also called Surface Mount Technology Assembly. It is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology, and has become a new generation of assembly technology in electronic product manufacturing. The main equipment of SMT production line includes: printing machine, placement machine (electronic components on...